Manufacturing and processing, assembling the surface adhesive of electronic components:
Resistor chips, protective components (types of chip fuses, electrostatic discharge suppression devices), thick film resistor networks, thick film integrated circuits of electronic components with a scale of 72,000 million pieces/year, of which:
+ Phase 1: 57,600 million pieces/year.
+ Phase 2: 14,400 million pieces/year.
Resistors become current sensing components with a scale of 1,200 million pieces/year, of which:
+ Phase 1: 960 million pieces/year.
+ Phase 2: 240 million pieces/year.

The project progress is as follows:
- Completion of investment procedures and construction permits: April 2022.
- Completion of construction work: March 2023.